Research on the Application of Perfluorocarbon Compounds in Immersion Liquid Cooling Systems: Technological Development and Market Landscape Centered on Perfluoropolyether (PFPE)
1. Technical Characteristics and Industry Value of Perfluorocarbon Compounds
Perfluorocarbon compounds, as new functional materials, exhibit irreplaceable technical advantages in immersion liquid cooling systems. Among them, perfluoropolyether (PFPE) has become the preferred medium for cooling solutions in current data centers and AI computing infrastructure due to its unique molecular structure. These compounds possess a highly symmetrical carbon-fluoride bond structure with bond energy reaching 485 kJ/mol, significantly higher than that of conventional carbon-hydrogen bonds at 414 kJ/mol, endowing them with excellent chemical stability. In typical operating environments of data centers, PFPE coolant can maintain molecular structural stability for over ten years, fully meeting the usage requirements throughout equipment life cycles.
From a thermodynamic performance perspective, PFPE's thermal conductivity can reach up to 0.12 W/(m·K). Although this value is lower than that of water (0.6 W/(m·K)), its unique low surface tension characteristic (approximately 16 dyn/cm) allows it to adequately wet electronic component surfaces and form uniform heat dissipation interfaces. More importantly, PFPE’s dielectric strength exceeds 35 kV/2.5mm with volume resistivity greater than 1×10^15 Ω·cm; these characteristics perfectly address short-circuit risks faced by traditional water cooling systems. As AI server chip power densities exceed 1000W/cm², PFPE materials are becoming key components supporting continuous upgrades in computing infrastructure.
2. Analysis of Core Suppliers' Technology Layouts and Market Competitiveness
2.1 The Full Industrial Chain Advantage of Juhua Co., Ltd As a leading domestic fluorochemical enterprise, Juhua Co., Ltd has achieved full industrial chain layout from fluorite ore to high-end coolants through its subsidiary Zhejiang Chuangfu High-tech Co., Ltd.. Its produced perfluoroether coolant reaches an electronic-grade purity standard of 99.9999%, controlling key impurity ion content at ppb levels which completely meets semiconductor manufacturing equipment's heat dissipation needs. Through self-developed molecular distillation purification technology, the company successfully controls production costs at about 30%-50% lower than imported products; this gives it significant price advantages in the domestic data center market currently under construction is a modular design project for producing giant core coolant at an annual capacity of 5000 tons that can flexibly adjust product capacity ratios based on market demand.
2.2 International Market Breakthroughs by Sinochem International Corporation Sinochem International Corporation is one among few global suppliers certified by ASML lithography machines for fluorinated liquids whose technological capabilities have been recognized by top international equipment manufacturers . The company's developed low-viscosity PFPE series products (<1 cSt dynamic viscosity) specifically target microchannel cooling demands for high-power GPUs achieving actual measured heat dissipation efficiency exceeding three times traditional solutions within NVIDIA A100/H100 servers . Notably ,the company employs unique molecular structure modification technologies controlling product boiling points within ideal ranges between180-220℃ ensuring operational stability while facilitating fluid recovery during system maintenance . Plans aimed towards expanding production capacities scheduled until2025 will focus primarily upon increasing proportions dedicated towards hydrofluroethers(HFE )series products addressing diverse power density thermal scenarios
**2 .3 Dongyang Sunshine ' s Differentiated Competitive Strategy ** nDongyang Sunshine develops DY -8900 dual-phase immersion coolant utilizing innovative nano-coating technology dispersing numerous micron-sized phase change material particles within base fluids . When chip temperatures exceed set thresholds ,these particles undergo phase changes absorbing substantial amounts heat enabling instantaneous responses against power fluctuations above1400W.In collaboration with Zhongji Xuchuang ,a dual-loop solution creatively combines cold plate style along with immersion techniques maintaining simplicity whilst reducing PUE values below1 .05.The company ' s proprietary48-hour zero-leakage technology stems from special sealing materials connections designed demonstrating no leakage occurrences across200 thermal cycling tests conducted thus far. n n ### Three Supporting Materials Emerging Applications Fields *3 * Environmental Solutions Developed By Yonghe Shares nYonghe shares subsidiaries Chuangfu High-Tech develop their JX series coolants employing closed-loop non-aqueous hydrogen fluoride production processes improving catalytic cracking recovery rates upwards97 % significantly lowering environmental burdens.This product particularly suits environmentally stringent European markets where Global warming potential(GWP )values remain less10 alongside ozone depletion potentials(ODP )being zero.Data collected regarding Ningde Times storage systems indicate using such coolants maintains battery pack temperature differentials controlledwithin±2 °C effectively extending cycle lives beyond30%. n *3 * Innovations From Zhongxin Fluoride Material Targeting Edge Computing nIn response small-scale requirements posed edge computing devices,Zhongxin Fluoride Material develops low-viscosity silicone oil-based coolants(<5cSt)resolving swelling issues traditionally associatedwith plastic components when exposedto fluorous liquids.By introducing specialized fluorinated surfactant additives,theirproducts retain exceptional thermal management properties while corrosion ratesagainst engineering plastics like ABS PC reduced annually below0.lmm.The technique finds successful applications deployed across Tencent’ s edge server clusters ensuring chips operate without exceeding85°C even under extreme ambient conditionsof45°C .
Four Industry Developments Dynamics Key Technical Challenges
**4 Market Demand Capacity Planning According To Latest IDC Forecasts
By2025 global demandfor flurinated liquids usedin datacenters projectedreachupwards scale often translatinginto roughly200 billion RMB worthmarketsize growth driven mainlythree factors :AIserver shipments averaging35%annual compound growth rate,chips breaking800Wthermal designpower limits alongside various nations enforcing stricter legislation surroundingdatacenter PUE metrics.Domestic major manufacturers ‘capacity expansion plans revealthatPF PE type productswill achieve complete import substitutionby2026 wherein Sinochem’s22 thousand ton/year planned output will accountover20%globalmarket share.
***4 Technological Evolution Trends Currently Seen Within Liquid Cooling Technologies Presently Display Cold Plate Styles Alongside Immersion Methods Concurrently Developing However Clear Divergence Has Emerged Based On Different Applications WithColdplate Designs Retaining Cost Advantages Existing DataCenter Renovation Projects Thanks Their Compatibility Traditional Air-Cooling Systems WhileImmersion Techniques Demonstrate DominanceHigh-Density Computation Scenarios Particularly RegardingNVIDIA GB200 Supercomputing Chips Wherein UsingPFPECoolant AchievesChip Surface-to-Liquid Temperature Differences Below15°C Remarkably WorthNoticing Phase Change ImmersionCoolingTechniques Have Begun ShowingBreakthrough Results At Laboratory Stages Likely EnhancingHeat Dissipation Efficiencies Further Upward Orders Of Magnitude.
**4 Potential Risks Strategies Addressing MainChallenges FacingIndustry EmergeTwofold First EU Initiatives DraftingRegulations LimitingUseOfPer- AndPoly-Fluoroalkyl Substances(PFAS)might ImpactExport Markets Second Graphene New Heat TransferMaterials PoseReplacement Threat Leading FirmsHave AdoptedThree ProactiveMeasures :Develop Short-chainPF PE Products Free C8 Segments ;Establish Closed Loop RecoverySystemsAchieving95+LiquidRecovery Rates ;Collaborate Chip ManufacturersTo CreateDirectionalThermalManagementSolutions.Long-term MeetingEU REACH Regulations Will Be CrucialForEco-Friendly Product Competitions Going Forward.